Gold Tin Alloy Particles (Au80Sn20) Description
Au80Sn20 particles exhibit a
eutectic microstructure (lamellar AuSn + Au₅Sn phases), ensuring a narrow
melting range (<5°C) for precise reflow. High thermal conductivity (57
W/m·K) and electrical resistivity (16 μΩ·cm) minimize junction temperatures in
power devices. Particles are >95% spherical (Hall flow rate <25 s/50g)
with oxygen content <200 ppm, suitable for vacuum reflow. Shear strength
>50 MPa outperforms SAC305, and fatigue resistance exceeds 10,000 thermal
cycles (-55°C to 150°C).
Gold Tin Alloy Particles (Au80Sn20) Applications
·
Semiconductors: Hermetic sealing of MEMS,
laser diodes.
·
Aerospace: RF module interconnects, satellite
shielding.
·
Medical: Implantable device encapsulation.
Gold Tin Alloy Particles (Au80Sn20) Packaging
Our products are packaged in customized cartons of various
sizes based on the material dimensions. Small items are securely packed in PP
boxes, while larger items are placed in custom wooden crates. We ensure strict
adherence to packaging customization and the use of appropriate cushioning
materials to provide optimal protection during transportation.
Packaging: Carton, Wooden Box, or Customized.
Kindly review the packaging
details provided for your reference.
Manufacturing Process
1. Testing Method
(1) Chemical Composition Analysis - Verified using techniques such
as GDMS or XRF to ensure compliance with purity requirements.
(2) Mechanical Properties Testing - Includes tensile strength,
yield strength, and elongation tests to assess material performance.
(3) Dimensional Inspection - Measures thickness, width, and
length to ensure adherence to specified tolerances.
(4) Surface Quality Inspection - Checks for defects such as
scratches, cracks, or inclusions through visual and ultrasonic examination.
(5) Hardness Testing - Determines material hardness to confirm
uniformity and mechanical reliability.
Please refer to the SAM testing procedures for detailed information.
Gold Tin Alloy Particles (Au80Sn20) FAQs
Q1. Why use Au80Sn20 instead of Pb-based solder?
RoHS-compliant, with superior thermal fatigue resistance and
void-free joints.
Q2. Can particles be used for flip-chip bonding?
Yes, 10-25 μm particles are ideal for fine-pitch (<100
μm) interconnects.
Q3. How to handle oxidation during storage?
Store in nitrogen-purged containers with desiccant;
pre-reflow bake at 150°C for 1 hour.
Performance Comparison Table with Competitive Products
|
Property
|
Au80Sn20
|
SAC305
|
In97/Ag3
|
|
Melting Point (°C)
|
280
|
217-220
|
157
|
|
Thermal Conductivity (W/m·K)
|
57
|
60
|
80
|
|
Shear Strength (MPa)
|
>50
|
35
|
15
|
|
Fatigue Cycles
|
>10,000
|
5,000
|
3,000
|
Related Information
1. Common Preparation Methods
Gas atomization of molten Au-Sn alloy under nitrogen,
followed by sieving (10-150 μm), acid cleaning, and vacuum drying.
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