Indium/Silver Alloy Foil (In97/Ag 3) Description
Indium/Silver Alloy Foil (In97/Ag 3) is engineered to deliver exceptional
performance in thermal management and electrical connectivity. Produced with
rigorous quality standards, this alloy foil offers superior ductility and
adaptability, enabling precision applications. With a melting point of
approximately 143°C, it is suitable for soldering processes where
low-temperature assembly is critical. Its reliable mechanical properties and
excellent thermal conductivity make it highly valuable in advanced electronic
manufacturing, high-performance thermal interfaces, and specialized sealing
applications.
Indium/Silver Alloy Foil (In97/Ag 3) Applications
Electronics
Assembly:
Optimal for low-temperature soldering and interconnect solutions in
semiconductor packaging.
Thermal Interface Materials: Efficiently dissipates heat in
electronic devices such as CPUs, GPUs, and high-power modules.
Sealing Solutions: Provides reliable hermetic seals in
cryogenic and vacuum applications due to excellent malleability and sealing
performance.
Medical Equipment: Utilized in medical device manufacturing
for precision sealing and reliable electrical connections.
Indium/Silver Alloy Foil (In97/Ag 3) Packing
Our Indium/Silver Alloy Foil (In97/Ag 3) is packaged with the utmost care to
maintain purity and product integrity.
Standard Vacuum-Sealed Packaging: Customized per client specifications
(typically 1kg per roll, customized quantities available).
Frequently Asked Questions
What is Indium/Silver Alloy Foil primarily used for?
It is primarily used for soldering, thermal management solutions, and hermetic
sealing in electronics and medical equipment due to its excellent thermal and
electrical properties.
Why choose In97/Ag 3 alloy for thermal management applications?
The In97/Ag 3 alloy is chosen for thermal management applications due to its
outstanding thermal conductivity, ductility, and low melting temperature,
facilitating efficient heat dissipation.
Can the thickness of Indium/Silver Alloy Foil be customized?
Yes, Stanford Advanced Materials provides customized thicknesses to meet
specific application requirements.
What makes Indium/Silver Alloy Foil suitable for electronics
assembly?
Its low melting point, high electrical conductivity, and ease of forming make
it ideal for precise, reliable soldering connections in electronics
manufacturing.
Is Indium/Silver Alloy Foil biocompatible?
Yes, Indium alloys generally exhibit good biocompatibility and are suitable for
medical and dental applications.
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