Copper (Cu) Sputtering Target Description
The Copper (Cu) Sputtering Target is engineered for
high-precision thin film deposition used in a variety of high-tech
applications. Manufactured with a purity of ≥99%, this target ensures
consistent and reliable performance in semiconductor fabrication, display
technologies, and photovoltaic devices. Its excellent electrical conductivity
and inherent corrosion resistance make it an ideal material for achieving high-quality
coatings under DC sputtering conditions. The product is available in disc form
or custom-made configurations to suit specialized industrial requirements.
Copper (Cu) Sputtering Target Applications
· Thin Film Deposition: Ideal for semiconductor
manufacturing, integrated circuits, and display panels.
· Vacuum Coating: Provides uniform, high-quality coatings for optical,
electronic, and solar applications.
· Surface Engineering: Enhances wear resistance and stability in various mechanical
and electronic components.
· Advanced Research: Used in laboratories for developing new materials and
nano-fabrication technologies.
Copper (Cu) Sputtering Target Packing
Our Copper (Cu) Sputtering Targets are securely packaged to
maintain their purity and performance during transit.
- Standard vacuum-sealed packaging options available in 5kg per bag or
customized packaging solutions upon request.
Frequently Asked Questions
Q: What are the main applications for the Copper (Cu)
Sputtering Target?
A: It is primarily used for thin film deposition in semiconductor
manufacturing, vacuum coating in display and solar industries, and advanced
surface engineering applications.
Q: What is the significance of achieving a purity level of
≥99%?
A: A high purity level ensures minimal contamination during sputtering, leading
to superior film quality and reliable performance in high-tech manufacturing
processes.
Q: Can the shapes of the Copper (Cu) Sputtering Target be
customized?
A: Yes, apart from standard discs, our targets can be custom-made to meet
specific design and application requirements.
Q: What does DC sputtering mean, and why is it important?
A: DC sputtering uses a direct current power supply to generate a plasma that
dislodges material from the target, ensuring uniform film deposition. This
technique is essential for high-quality thin film applications.
Q: How is the Copper (Cu) Sputtering Target packaged to
ensure its quality?
A: The target is vacuum-sealed in specialized packaging to protect it from
contamination and physical damage during storage and transportation.
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