Tantalum Nitride (TaN) Sputtering Target Description
The Tantalum Nitride (TaN) Sputtering Target is engineered
for high-performance sputtering processes in advanced industrial applications.
Manufactured with a purity of ≥99% and precision design, this target ensures
consistent deposition and high-quality thin films even under demanding
operational conditions. Its compatibility with both RF and RF-R sputtering
methods makes it an ideal choice for semiconductor fabrication, surface
engineering, and advanced research applications.
Tantalum Nitride (TaN) Sputtering Target Applications
· Semiconductor Fabrication: Ideal for depositing
high-quality metal nitride films in integrated circuits and display
technologies.
· Thin Film Deposition: Used in the production of protective and functional
coatings for optical, electronic, and mechanical applications.
· Advanced Research: Provides reliable performance in experimental setups
requiring high purity sputtering materials for novel applications.
· Surface Engineering: Enhances wear resistance and thermal stability in components
through precise thin film application.
Tantalum Nitride (TaN) Sputtering Target Packing
Each Tantalum Nitride (TaN) Sputtering Target is carefully
packaged in a protective, vacuum-sealed container to preserve its integrity
during storage and transportation. Custom packaging options are available to
meet specific customer requirements.
Frequently Asked Questions
Q: What are the common applications of Tantalum Nitride
(TaN) Sputtering Targets?
A: They are used for depositing high-quality thin films in semiconductor
devices, displays, integrated circuits, and various advanced coating
applications.
Q: Which sputtering methods can be used with this target?
A: This target is compatible with both RF and RF-R sputtering processes,
providing versatility for different deposition techniques.
Q: How does the high purity (≥99%) affect sputtering
performance?
A: High purity minimizes contamination during the sputtering process, resulting
in superior film quality, consistent electrical properties, and enhanced overall
performance.
Q: Are custom-made shapes available for this sputtering
target?
A: Yes, besides standard discs, the target can be manufactured in custom shapes
to meet specific application requirements.
Q: What types of bonding are incorporated in this product?
A: The product utilizes Indium and Elastomer bonds to ensure secure attachment
of the target material and efficient heat dissipation during operation.
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