Iron Carbide (Fe3C) Sputtering Target Description
Iron Carbide (Fe3C) Sputtering Target is engineered for
optimal performance in various sputtering processes utilized in
microelectronics, thin film deposition, and surface coating applications.
Manufactured with a purity of ≥99%, this target offers exceptional uniformity
and durability during sputtering deposition. The design allows for
customization in size and shape to meet specific industry requirements.
Furthermore, its high melting point (~1227℃) and density (~7.7 g/cm³) provide
superior thermal stability and mechanical integrity, ensuring consistent and
reliable performance in precision applications.
Iron Carbide (Fe3C) Sputtering Target Applications
· Thin Film Deposition: Ideal for fabricating high-quality
films in semiconductor devices.
· Microelectronic Components: Used in the manufacturing of specialized
microstructures in electronics.
· Protective Coatings: Deposited as functional coatings on various industrial
tools and surfaces.
· Research and Development: Beneficial for materials science experiments and
innovative technology exploration.
· Surface Engineering: Employed in industrial processes requiring durable and
stable coating layers for enhanced performance.
Iron Carbide (Fe3C) Sputtering Target Packing
Our Iron Carbide Sputtering Target is meticulously packaged
to preserve its high purity and performance characteristics. It is commonly
delivered in protective, anti-corrosive containers and, if required,
vacuum-sealed to ensure integrity during storage and transportation. Packaging
options can be customized to meet your specific logistics and handling needs.
Frequently Asked Questions
Q: What industries commonly use Iron Carbide sputtering
targets?
A: They are widely used in semiconductor fabrication, microelectronics, and
advanced coatings across various industrial applications.
Q: What is the significance of having a purity of ≥99% in
this sputtering target?
A: High purity is essential for consistent sputtering performance, minimizing
impurities that could adversely affect film quality and deposition efficiency.
Q: Are the shapes of the sputtering targets customizable?
A: Yes, our targets are available as standard discs or can be custom-made to
meet unique design specifications and dimensions.
Q: How does the melting point of ~1227℃ benefit the
sputtering process?
A: A high melting point ensures that the target maintains its structural and
chemical integrity under high thermal loads during sputtering, leading to more
stable and consistent deposition.
Q: Why is the density of ~7.7 g/cm³ important in sputtering
applications?
A: The density plays a crucial role in determining the sputtering yield and
deposition efficiency, contributing to a more predictable and controlled
deposition process.
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