Copper Selenide (CuSe) Sputtering Target Description
The Copper Selenide (CuSe) Sputtering Target is engineered
with exceptional purity (≥99%) for precision thin film deposition. Manufactured
in disc form or as custom-made targets, this material is designed to deliver
stable composition and reproducible performance in demanding industrial
applications. Its reliable properties make it ideal for semiconductor
processes, optoelectronic device fabrication, and other advanced technologies
where controlled material deposition is crucial.
Copper Selenide (CuSe) Sputtering Target Applications
· Thin Film Deposition: Essential for fabricating
semiconductor devices and integrated circuits.
· Optoelectronics: Used in the production of photodetectors, solar cells, and
light-emitting devices.
· Surface Coating: Provides uniform and controlled coating in high precision
industrial applications.
· Research and Development: Ideal for experimental setups in material science
and nanotechnology laboratories.
Copper Selenide (CuSe) Sputtering Target Packing
Our Copper Selenide (CuSe) Sputtering Targets are packaged
with care to maintain their pristine condition during storage and
transportation. Typically, products are vacuum-sealed in protective packaging,
with weight options and container sizes customizable based on client
requirements.
Frequently Asked Questions
Q: What industries benefit most from using the Copper
Selenide Sputtering Target?
A: It is widely used in semiconductor manufacturing, optoelectronics, and
surface coating applications, making it valuable in high-tech industrial and
research settings.
Q: How does the purity level of the CuSe target affect its
performance?
A: A purity level of ≥99% ensures high-quality thin film deposition with
minimal impurities, leading to more reliable and reproducible results in device
fabrication.
Q: Can the shape and size of the target be customized?
A: Yes, our Copper Selenide Sputtering Targets are available in standard disc
shapes or can be custom-made to meet specific application requirements.
Q: What are the main characteristics to consider when
selecting a sputtering target?
A: Key characteristics include composition, purity, melting point, density, and
the physical dimensions of the target, all of which influence deposition
quality and process stability.
Q: What measures are taken to ensure the stability of the
material during storage and transportation?
A: The targets are vacuum-sealed and carefully packaged to protect against
oxidation and physical damage, ensuring they maintain their high performance
until usage.
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