Lanthanum Gallate (LaGaO3) Sputtering Target Description
The Lanthanum Gallate (LaGaO3) Sputtering Target is
engineered for precision in advanced thin film deposition. Manufactured under
stringent quality controls, this target exhibits excellent purity and stable
performance. It is designed to meet the rigorous demands of modern sputtering
applications, providing reliable and uniform film coatings for electronics,
optics, and research applications. The versatility in shapes, including
standard discs and custom-made designs, enables optimal integration into
diverse sputtering systems.
Lanthanum Gallate (LaGaO3) Sputtering Target Applications
· Thin film deposition in electronic devices and optical
components.
· Advanced ceramics coating for improved wear resistance and performance.
· Research and development in material science and nanotechnology.
· Surface modification processes in various high-tech industrial applications.
· Specialized sputtering processes requiring high purity and customizable
target geometries.
Lanthanum Gallate (LaGaO3) Sputtering Target Packing
Our Lanthanum Gallate (LaGaO3) Sputtering Targets are
packaged with care to maintain product integrity during storage and transport.
Products are vacuum-sealed and can be supplied in standard disc form or in
custom dimensions per customer specifications.
Frequently Asked Questions
Q: What is the primary application of the Lanthanum Gallate
(LaGaO3) Sputtering Target?
A: It is primarily used for thin film deposition in advanced electronics,
optics, and research applications.
Q: What level of purity is guaranteed for this sputtering
target?
A: The product is guaranteed to have a purity of ≥99%.
Q: Are custom shapes available for this product?
A: Yes, besides conventional discs, custom-made shapes can be produced to meet
specific requirements.
Q: How does the density of 6.93 g/cm³ affect the sputtering
process?
A: The specified density ensures consistent material performance and stable
sputtering characteristics during deposition processes.
Q: What bonding methods are utilized for this sputtering
target?
A: The target employs Indium and Elastomer bonding to optimize performance
under sputtering conditions.
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