단종 (단종) ST0901 코발트 크롬 철 니켈 알루미늄 고엔트로피 합금 (HEA) 스퍼터링 타겟, Co/Cr/Fe/Ni/Al

Cobalt Chromium Iron Nickel Aluminum HEA Sputtering Target Description

The Cobalt Chromium Iron Nickel Aluminum High-Entropy Alloy (HEA) Sputtering Target is engineered for precision thin film deposition procedures. Manufactured with a purity of ≥99%, this target is available in standard disc shapes or can be custom-made to meet specific application requirements. Its high-performance bonding using indium ensures reliable electrical contact during sputtering, making it an excellent choice for advanced industrial applications in semiconductor manufacturing and microelectronics. Designed with innovation in mind, this product delivers consistent performance in demanding environments while adhering to the highest quality standards.

Cobalt Chromium Iron Nickel Aluminum HEA Sputtering Target Applications

· Thin Film Deposition: Ideal for semiconductor manufacturing, solar cell coating, and microelectronic device fabrication.
· Microelectronics: Used in the production of display panels, integrated circuits, and advanced sensor devices.
· Research and Development: Suitable for experimental setups and the development of novel thin film applications.
· Industrial Coatings: Provides a reliable material base for protective or functional coatings in various high-tech industries.

Cobalt Chromium Iron Nickel Aluminum HEA Sputtering Target Packing

Our sputtering targets are carefully packaged to maintain their pristine condition during transit. Packaging is tailored to customer requirements, with options for vacuum sealing and custom container designs to ensure optimal preservation and ease of handling.

Frequently Asked Questions

Q: What industries typically use this sputtering target?
A: It is commonly used in semiconductor manufacturing, solar cell production, microelectronics, and advanced research applications.

Q: What is the purity level of this HEA sputtering target?
A: The target offers a high purity of ≥99%, ensuring excellent performance during sputtering processes.

Q: Can the shape of the sputtering target be customized?
A: Yes, the targets are available in standard disc shapes or can be custom-made to fit specific application requirements.

Q: What bonding material is used in these targets?
A: Indium is used as the bonding material to ensure optimal electrical contact during the sputtering process.

Q: How can I obtain packaging options for my order?
A: Packaging options are customizable; please contact our support team to discuss your specific shipping and handling requirements.