Titanium Carbonitride Sputtering Target Description
The Titanium Carbonitride Sputtering Target, TiCN, is
engineered for high-performance coating applications. Manufactured with a focus
on precision and purity, this target material is optimized for sputtering
processes, ensuring uniform deposition and excellent adhesion of thin films.
Its robust thermal properties and customizable shapes make it ideal for
semiconductor fabrication, optical coatings, and aerospace applications. With a
purity of ≥99%, this target is designed to meet the most stringent industry
requirements while delivering exceptional performance.
Titanium Carbonitride Sputtering Target Applications
· Thin Film Deposition: Ideal for creating uniform and
durable coatings in semiconductor and microelectronics fabrication.
· Optical Coatings: Used in the production of anti-reflective and
high-reflectivity coatings for optical devices.
· Aerospace and Automotive: Suitable for high-temperature applications
requiring robust thermal stability and corrosion resistance.
· Research and Development: Provides consistent performance for experimental
use in advanced material studies.
Titanium Carbonitride Sputtering Target Packing
Our Titanium Carbonitride Sputtering Target is carefully
handled and packaged to maintain its high purity and performance. Options
include vacuum-sealed packaging for optimal protection and custom packaging
solutions tailored to specific client requirements.
Frequently Asked Questions
Q: What applications is the Titanium Carbonitride Sputtering
Target used in?
A: It is primarily used in thin film deposition, semiconductor fabrication,
optical coatings, and aerospace applications.
Q: How is the material purity of ≥99% ensured?
A: Advanced manufacturing techniques along with rigorous quality control
measures ensure that our TiCN targets meet the highest purity standards.
Q: What shapes are available for the TiCN Sputtering Target?
A: The target is available in standard disc shapes or can be custom-made to
suit specific application requirements.
Q: Why is a melting point of >350°C important for this
product?
A: A high melting point ensures that the target material can withstand the
high-energy conditions of sputtering processes without degradation.
Q: What advantages does the Indium bond provide in the TiCN
Sputtering Target?
A: The Indium bond offers excellent electrical conduction and efficient thermal
management, which are critical for high-precision sputtering applications.
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