Neodymium Fluoride Sputtering Target Description
The Neodymium Fluoride Sputtering Target, NdF3 is engineered
for precision and reliability in high-tech applications. Manufactured with a
focus on achieving ≥99% purity, the target is available in disc form or as
custom-made designs to meet specific production requirements. Its excellent
thermal stability, indicated by its melting point of 1410 °C, and high density
of 7.0 g/cm³ make it ideal for advanced sputtering processes. The incorporation
of indium as a bonding agent further enhances its performance by ensuring
consistent material deposition and process stability during sputtering
operations.
Neodymium Fluoride Sputtering Target Applications
· Semiconductor Manufacturing: Essential for depositing thin
films in microelectronics.
· Optical Coatings: Used in the production of high-precision optical
components.
· Advanced Material Research: Ideal for experimental sputtering in research and
development laboratories.
· Thin Film Deposition: Ensures uniform deposition for sensors and innovative
device manufacturing.
Neodymium Fluoride Sputtering Target Packing
Each target is meticulously packaged to ensure minimal
contamination and maximum preservation of quality. Customized packaging options
are available to meet the specific needs of both research institutions and
industrial applications.
Frequently Asked Questions
Q: What is the primary application of the Neodymium Fluoride
Sputtering Target?
A: It is mainly used in sputtering processes for semiconductor manufacturing,
thin film deposition, and optical coatings.
Q: How is the purity of the NdF₃ target ensured?
A: Our targets are produced under strict quality control protocols, ensuring a
purity level of ≥99%.
Q: Can I order a custom-designed target shape?
A: Yes, we offer custom-made shapes to fit specific manufacturing requirements.
Q: What are the storage recommendations for these sputtering
targets?
A: It is recommended to store them in a controlled, dry environment to prevent
contamination and degradation.
Q: How does the indium bonding influence the sputtering
process?
A: The indium bonding enhances adhesion and ensures uniform material deposition
during sputtering operations.
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