Molybdenum Rhenium Sputtering Target Description
The Molybdenum Rhenium Sputtering Target, Mo-Re is a
high-performance material designed for advanced sputtering deposition processes
in microelectronics and thin film applications. With a purity of ≥99%, this
target ensures consistent and uniform film formation critical for high-tech
manufacturing. Offered in disc shapes or custom-made formats, it is engineered
to meet the precise requirements of modern sputtering systems, delivering both
reliability and excellent processing performance.
Molybdenum Rhenium Sputtering Target Applications
· Semiconductor Fabrication: Ideal for producing
high-performance thin films in microelectronic device manufacturing.
· Thin Film Deposition: Used in advanced coating applications for optics,
electronics, and decorative surfaces.
· Microelectronics: Supports the production of integrated circuits and
electronic components with high precision.
· Research & Development: Serves as a reliable material for experimental
and pilot-scale sputtering processes.
Molybdenum Rhenium Sputtering Target Packing
Our Molybdenum Rhenium Sputtering Target is packaged
according to customer specifications to ensure it remains in pristine condition
during storage and transportation. Custom packaging solutions are available to
meet specific process and shipping requirements.
Frequently Asked Questions
Q: What is the composition of this sputtering target?
A: It is composed of a Mo-Re alloy with a purity of ≥99%.
Q: What shapes can this target be provided in?
A: The target is available in disc shapes or can be custom-made based on
specific requirements.
Q: What bonding material is used for this product?
A: Indium is used for bonding in this sputtering target.
Q: Is the melting point specified for this material?
A: The melting point is listed as N/A.
Q: Can I get the sputtering target in a custom size?
A: Yes, available sizes are fully customizable to meet your application needs.