LB6736 Su-8 몰드 및 PDMS 칩

Su-8 Mold & PDMS Chip Description

SU-8 is a high-performance negative photoresist renowned for its superior mechanical, dielectric, and chemical resistance, as well as its excellent thermal stability and biocompatibility. Widely used in the microfluidic industry, SU-8 is essential for fabricating molds for PDMS-based microfluidic chips through photolithography.

Advantages of SU-8 molds in microfluidic fabrication:

1.       High Resolution and Precision: SU-8 is known for its high-resolution capabilities, enabling the creation of intricate and precise microchannel designs. This makes it ideal for fabricating complex microfluidic structures with fine details down to the micron scale.

2.       Durability and Toughness: SU-8 molds are exceptionally durable, maintaining their integrity through multiple cycles of use, cleaning, and handling. This makes them well-suited for repeated PDMS casting, providing long-lasting mold stability.

3.       Versatile Geometries and Aspect Ratios: SU-8 enables the fabrication of microstructures with fine line widths as narrow as 2 micrometers and aspect ratios ranging from 1:1 to 2:1. Advanced multilayer photolithography techniques allow the creation of microchannel structures with varying heights, offering flexibility in designing complex microfluidic systems.

Su-8 Mold & PDMS Chip Applications

·          Microfluidic Devices: Used in the creation of microfluidic chips for precise fluid control in lab-on-a-chip devices.

·          Biomedical Research: Ideal for creating microchannels for cell culture, DNA analysis, and diagnostic testing.

·          Point-of-Care Diagnostics: Facilitates the development of portable, low-cost diagnostic devices for rapid medical testing.

·          Chemical Sensing: Used in chemical detection and analysis, where fluid manipulation on a small scale is essential.

·          Organ-on-a-chip Systems: Employed in the development of systems that mimic biological tissues for drug testing and disease modeling.

Su-8 Mold & PDMS Chip Packaging

Our products are packaged in customized cartons of various sizes based on the material dimensions. Small items are securely packed in PP boxes, while larger items are placed in custom wooden crates. We ensure strict adherence to packaging customization and the use of appropriate cushioning materials to provide optimal protection during transportation.

Packaging: Carton, Wooden Box, or Customized.

Kindly review the packaging details provided for your reference.

Manufacturing Process

1.       Preparation Process

(1)    Substrate Preparation: Clean the silicon wafer and ensure the surface is dust-free.

(2)    Spin Coating:

Place the wafer on the spin coater and secure it.

Dispense SU-8 photoresist and set the spin speed/time for desired thickness.

(3)    Soft Bake: Bake the coated wafer on a hotplate to remove solvents.

(4)    Exposure:

Place the wafer on the mask aligner.

Expose the wafer using the appropriate mask for the required exposure time and intensity.

(5)    Post-Bake: Post-exposure bake to complete cross-linking.

(6)    Development: Immerse in developer to dissolve unexposed photoresist, forming the pattern.

(7)    Cleaning: Rinse with isopropanol to remove excess photoresist.

(8)    Inspection: Inspect the wafer under a microscope for pattern clarity and accuracy.

2.       Testing Method

(1)    Chemical Composition Analysis - Verified using techniques such as GDMS or XRF to ensure compliance with purity requirements.

(2)    Mechanical Properties Testing - Includes tensile strength, yield strength, and elongation tests to assess material performance.

(3)    Dimensional Inspection - Measures thickness, width, and length to ensure adherence to specified tolerances.

(4)    Surface Quality Inspection - Checks for defects such as scratches, cracks, or inclusions through visual and ultrasonic examination.

(5)    Hardness Testing - Determines material hardness to confirm uniformity and mechanical reliability.

Please refer to the SAM testing procedures for detailed information.

Su-8 Mold & PDMS Chip FAQs

Q1. What are SU-8 molds and PDMS chips?

SU-8 molds are high-resolution, negative photoresist molds used in photolithography to create microstructures for applications such as microfluidics.

PDMS chips are microfluidic chips made from polydimethylsiloxane (PDMS), a soft and flexible material that is widely used to create microchannel-based devices for fluid manipulation.

Q2. What are the advantages of using SU-8 molds and PDMS chips?

SU-8 molds offer high resolution, durability, and precise control over microchannel geometries, allowing the production of intricate designs with excellent dimensional accuracy.

PDMS chips provide excellent biocompatibility, transparency, and ease of fabrication, making them ideal for applications in biomedical research, diagnostics, and microfluidic devices.

Q3. What are the main applications of SU-8 molds and PDMS chips?

They are primarily used in microfluidic devices, lab-on-a-chip systems, biomedical research, point-of-care diagnostics, chemical sensing, and drug testing.